Guest Editorial 2022 IEEE International Conference on Flexible, Printable Sensors and Systems (FLEPS)

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چکیده

It is with great pleasure that we present this Special Issue for IEEE Journal on Flexible Electronics (J-FLEX), dedicated to the extended papers from 2022 International Conference Flexible, Printable Sensors and Systems (FLEPS), held in Vienna, Austria. FLEPS sponsored by Council, one of our leading J-FLEX sponsors. As Guest Editorial Board, are delighted bring together a collection cutting-edge research advancements field flexible printed electronics.

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ژورنال

عنوان ژورنال: IEEE journal on flexible electronics

سال: 2023

ISSN: ['2768-167X']

DOI: https://doi.org/10.1109/jflex.2023.3281915